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Product Description
1. Automatic inspection:
Use high-resolution industrial cameras or laser scanning systems to detect surface defects of single boards in real time and accurately mark their position, size, and shape.
2. Intelligent excavation and patching:
Automatically remove defective parts through CNC tools or lasers, and match them with patches for seamless repair.
3. Multi-material adaptation:
Supports single boards of different thicknesses (2-25mm) and materials, and can adjust the depth and diameter of the patching (5-50mm).
4. Efficient production:
The processing speed can reach 1-3 seconds per defect, continuous operation, and is suitable for large-scale production lines.
Product Characteristics
1. Adopting wire cutting technology.
2. High precision processing.
3. Precise cutting of complex contours.
4. High automation efficiency can avoid material deformation.
Product Parameters
Product Description
1. Automatic inspection:
Use high-resolution industrial cameras or laser scanning systems to detect surface defects of single boards in real time and accurately mark their position, size, and shape.
2. Intelligent excavation and patching:
Automatically remove defective parts through CNC tools or lasers, and match them with patches for seamless repair.
3. Multi-material adaptation:
Supports single boards of different thicknesses (2-25mm) and materials, and can adjust the depth and diameter of the patching (5-50mm).
4. Efficient production:
The processing speed can reach 1-3 seconds per defect, continuous operation, and is suitable for large-scale production lines.
Product Characteristics
1. Adopting wire cutting technology.
2. High precision processing.
3. Precise cutting of complex contours.
4. High automation efficiency can avoid material deformation.
Product Parameters
