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Product Description
1. Automatic inspection:
Use high-resolution industrial cameras or laser scanning systems to detect surface defects of single boards in real time and accurately mark their position, size, and shape.
2. Intelligent excavation and patching:
Automatically remove defective parts through CNC tools or lasers, and match them with patches for seamless repair.
3. Multi-material adaptation:
Supports single boards of different thicknesses (2-25mm) and materials, and can adjust the depth and diameter of the patching (5-50mm).
4. Efficient production:
The processing speed can reach 1-3 seconds per defect, continuous operation, and is suitable for large-scale production lines.
Product Characteristics
1. Adopting wire cutting technology.
2. High precision processing.
3. Precise cutting of complex contours.
4. High automation efficiency can avoid material deformation.
Product Parameters
